Call for Papers

专题1：Computers, Materials & Continua刊物: https://www.techscience.com/journal/cmc

投稿专属链接：https://ijs.tspsubmission.com/page/index.html#/submission?id=1&sectionid=2939

专题2：AI-Enabled Intelligent Embedded Architectures for Edge and Real-Time Systems，

官网：https://www.mdpi.com/journal/electronics/special_issues/S45W3FM49H

专题3：Symmetry and Asymmetry in Embedded Systems, 2nd Edition 官网：https://www.mdpi.com/journal/symmetry/special_issues/29268SGVY4